The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Sep. 11, 2023
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventors:
Romain Coffy, Voiron, FR;
Jerome Lopez, Saint Jean de Moirans, FR;
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H10W 40/22 (2026.01); H10W 40/25 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 40/226 (2026.01); H10W 40/255 (2026.01); H10W 90/701 (2026.01); H10W 72/07253 (2026.01); H10W 72/232 (2026.01); H10W 74/142 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
An integrated circuit includes an electronic chip having a face covered with a thermal interface material layer. A heat sink includes a mounting area fixed to the chip via the thermal interface material layer. The heat sink includes open notches extending into the mounting area to delimit fins separated from each other by the open notches.
Coffy, Romain. (2026). Integrated circuit package heat sink (U.S. Patent No. 12733492). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12733492
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile