The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Feb. 07, 2022
Applicant:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Inventors:

Ryo Akiba, Hitachinaka, JP;

Yoshio Kawai, Hitachinaka, JP;

Keiko Ueno, Hitachinaka, JP;

Assignee:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01);
U.S. Cl.
CPC ...
H10W 40/22 (2026.01);
Abstract

An electronic control device capable of achieving both high heat dissipation and solder connection reliability is achieved. An electronic control deviceincludes a circuit boardmounted with an electronic componentand a connector, a basehousing this circuit board, a coverclosing this base, a heat dissipation pedestalformed on the base, and a thermally conductive materialarranged on an upper surface of this heat dissipation pedestal. On the upper surface of the heat dissipation pedestalon which the thermally conductive materialis arranged, a plurality of groovesformed radially from the center of the upper surface of the heat dissipation pedestaland where the thermally conductive materialenters are formed. The electronic componentis configured to be in contact with the heat dissipation pedestalvia the thermally conductive material. This can achieve an electronic control device capable of achieving both high heat dissipation and solder connection reliability.


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