The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Feb. 08, 2022
Macom Technology Solutions Holdings, Inc., Lowell, MA (US);
Andrzej Rozbicki, Saratoga, CA (US);
Belinda Simone Edmee Piernas, Mason, NH (US);
David Russell Hoag, Walpole, MA (US);
James Joseph Brogle, Merrimac, MA (US);
Timothy Edward Boles, Tyngsboro, MA (US);
MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC., Lowell, MA (US);
Abstract
Semiconductor devices are described. In one example, the semiconductor device includes a substrate, a layer of first semiconductor material over the substrate, a layer of second semiconductor material over the layer of first semiconductor material, a first metal contact formed on the layer of first semiconductor material, a second metal contact formed on the layer of second semiconductor material, and a metal via that extends from a backside of the substrate, through the substrate, through the layer of first semiconductor material, and contacts a bottom surface of the first metal contact. In this configuration, a direct electrical connection can be achieved between the backside of the substrate and the metal contact on the layer of first semiconductor material without the need for an additional metal connection, such as a metal air bridge, to the metal contact.