The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Mar. 09, 2023
Applicant:

Ngk Insulators, Ltd., Nagoya-City, JP;

Inventors:

Mitsuru Kojima, Handa-City, JP;

Hiroshi Takebayashi, Handa-City, JP;

Jyunya Waki, Handa-City, JP;

Assignee:

NGK INSULATORS, LTD., Nagoya-City, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0402 (2026.01); H10P 72/7616 (2026.01); H10P 72/7624 (2026.01);
Abstract

A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface; a conductive base plate; a gas common passage provided inside the base plate; gas outlet passages provided to reach the wafer placement surface from the gas common passage; at least one gas inlet passage provided to communicate with the gas common passage from a lower surface of the base plate; and an insulating sleeve disposed in a base plate through-hole. The insulating sleeve has a first communication hole that constitutes part of the gas common passage, and a second communication hole that is provided to reach an upper surface of the insulating sleeve from the first communication hole, and constitute part of the gas outlet passages.


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