The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Nov. 14, 2022
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventor:
Tetsuya Kamimura, Haibara-gun, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 70/00 (2026.01); C09K 13/06 (2006.01); C11D 3/04 (2006.01); C11D 7/08 (2006.01);
U.S. Cl.
CPC ...
H10P 70/27 (2026.01); C09K 13/06 (2013.01); C11D 3/042 (2013.01); C11D 7/08 (2013.01); H10P 70/277 (2026.01); C11D 2111/22 (2024.01);
Abstract
The present invention provides a cleaning liquid for a semiconductor substrate that has been subjected to CMP, in which the cleaning liquid has an excellent selectivity for RuOremoving performance; and a method for cleaning a semiconductor substrate that has been subjected to CMP. The cleaning liquid of an embodiment of the present invention is a cleaning liquid for a semiconductor substrate that has been subjected to a chemical mechanical polishing treatment, in which the cleaning liquid includes a perhalogen acid and a halogen acid.