The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jun. 29, 2022
Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Yuanzheng Guo, Beijing, CN;
Xiaoqi Ding, Beijing, CN;
Tao Gao, Beijing, CN;
Liqiang Chen, Beijing, CN;
Li Jia, Beijing, CN;
Dianjie Hou, Beijing, CN;
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Chengdu, CN;
BOE TECHNOLOGY GROUP CO., LTD, Beijing, CN;
Abstract
A substrate includes a first base, a first trace, a first organic layer, a first inorganic layer, and a second trace. The first organic layer includes at least one first via hole, and a first via hole exposes a portion of the first trace. The first inorganic layer includes at least one second via hole. On the first base, an orthographic projection of an edge of an opening of a second via hole proximate to the first via hole is substantially coincident with an orthographic projection of an edge of an opening of the first via hole proximate to the second via hole. The first and second via holes are communicated to form a connecting hole to connect the first and second traces. A ratio of a depth of the connecting hole to a maximum radial dimension of the connecting hole ranges from 1:1 to 1:2, inclusive.