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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12733314 B1

PDFFull Text
Date of Patent:
Sep. 08, 2026

Filed:

Dec. 10, 2020

Optoelectronic semiconductor element including a casing embedding a semiconductor chip and with crack nuclei located in the casing, and method for operating such an optoelectronic semiconductor element

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Christian Betthausen, Lappersdorf, DE;

Olivier Leray, Regensburg, DE;

Muyuan Li, Regensburg, DE;

Benjamin Gruber, Regensburg, DE;

Michael Steyer, Neutraubling, DE;

Alexander Linkov, JL Waalre, NL;

Stefan Handl, Zell, DE;

Assignee:

OSRAM Opto Semiconductors GmbH, Regensburg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Norman D Richards

Assistant Examiner:

Ethan Edward Cutler

Int. Cl.
CPC ...
H10H 20/855 (2025.01); H10H 20/85 (2025.01);
U.S. Cl.
CPC ...
H10H 20/855 (2025.01); H10H 20/8506 (2025.01);
Abstract

In an embodiment a method for operating an optoelectronic semiconductor component includes providing the optoelectronic semiconductor component having an optoelectronic semiconductor chip and a casing comprising a matrix material, wherein the semiconductor chip is embedded into the casing, and wherein optically inactive particles have been introduced as crack nuclei into the matrix material of the casing, and operating the optoelectronic semiconductor component such that cavities form entirely within the casing for at least some of the crack nuclei.

Find Patent Forward Citations

Betthausen, Christian. (2026). Optoelectronic semiconductor element including a casing embedding a semiconductor chip and with crack nuclei located in the casing, and method for operating such an optoelectronic semiconductor element (U.S. Patent No. 12733314). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12733314

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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