The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Jun. 30, 2023
Applicant:

Artilux, Inc., Menlo Park, CA (US);

Inventors:

Huei-Hsiung Hsu, Hsinchu County, TW;

Cheng-Te Yu, Hsinchu County, TW;

Yu-Ting Chiu, Hsinchu County, TW;

Assignee:

Artilux, Inc., Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 55/00 (2025.01); H10F 71/00 (2025.01); H10F 77/122 (2025.01); H10F 77/30 (2025.01); H10F 77/50 (2025.01);
U.S. Cl.
CPC ...
H10F 55/18 (2025.01); H10F 71/1212 (2025.01); H10F 77/122 (2025.01); H10F 77/334 (2025.01); H10F 77/50 (2025.01);
Abstract

Systems, apparatuses, and methods for optical sensing are provided. For example, an optical sensing apparatus can include a substrate, a light-receiving device, a light-emitting device, an encapsulating structure, a covering cap, and an adhesive layer. The light-receiving device and the light-emitting device can be disposed on and electrically connected to the substrate. The encapsulating structure can be disposed on the substrate and cover the light-emitting device and the light-receiving device. The encapsulating structure can include a top surface, a first side surface, and a lower surface. The first side surface and the lower surface can collectively form a recess. The covering cap can be disposed on the encapsulating structure and can include a first opening, a top portion, a protruding portion, and an extending portion. The adhesive layer can be arranged between the encapsulating structure and the covering cap to adhere the encapsulating structure and the covering cap.


Find Patent Forward Citations

Loading…