The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jul. 21, 2023
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Junji Iwata, Tokyo, JP;
Kazuhiro Morimoto, Kanagawa, JP;
Yu Maehashi, Tokyo, JP;
Yoshiyuki Hayashi, Tokyo, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H04N 25/705 (2023.01); H04N 25/75 (2023.01); H10F 30/225 (2025.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H04N 25/705 (2023.01); H10F 30/225 (2025.01); H04N 25/75 (2023.01);
Abstract
An apparatus includes a first substrate having a plurality of avalanche diodes, a second substrate having a plurality of pixel circuits, and a third substrate having a signal processing circuit. The second substrate and the third substrate are stacked in such a manner that a third wiring structure is provided between two semiconductor layers of the second substrate and the third substrate. The apparatus includes first through-hole wiring going through the semiconductor layer of the third substrate.