The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Oct. 02, 2023
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Kazuaki Tsuchiyama, Tokyo, JP;

Tatsuaki Tsukuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 80/00 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 72/50 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H10W 90/00 (2026.01); H10W 72/073 (2026.01); H10W 72/07341 (2026.01); H10W 72/07352 (2026.01); H10W 72/07354 (2026.01); H10W 72/075 (2026.01); H10W 72/07554 (2026.01); H10W 72/327 (2026.01); H10W 72/347 (2026.01); H10W 72/5449 (2026.01); H10W 72/547 (2026.01); H10W 72/5522 (2026.01); H10W 72/5524 (2026.01); H10W 72/5525 (2026.01); H10W 72/865 (2026.01); H10W 72/884 (2026.01); H10W 72/932 (2026.01); H10W 72/9445 (2026.01); H10W 90/734 (2026.01); H10W 90/738 (2026.01); H10W 90/752 (2026.01); H10W 90/753 (2026.01); H10W 90/754 (2026.01); H10W 90/756 (2026.01); H10W 90/758 (2026.01); H10W 90/759 (2026.01);
Abstract

A semiconductor device includes: a base material having a first terminal; a semiconductor chip having a first electrode pad electrically connected with the first terminal, a second electrode pad to which a power supply potential is to be supplied, and a third electrode pad to which a reference potential is to be supplied, and mounted on the base material via a first member; a chip capacitor having a first electrode and a second electrode, and mounted on the semiconductor chip via a second member; a first wire electrically connecting the first electrode pad with the first terminal; a second wire electrically connecting the second electrode pad with the first electrode without going through the base material; and a third wire electrically connecting the third electrode pad with the second electrode without going through the base material.


Find Patent Forward Citations

Tsuchiyama, Kazuaki. (2026). Semiconductor device having chip capacitor connected to semiconductor chip with wires (U.S. Patent No. 12733183). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12733183

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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