The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Mar. 06, 2023
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Dai-Ying Lee, Hsinchu County, TW;

Cheng-Hsien Lu, Taoyuan City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 80/00 (2026.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01); H10W 80/00 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H10W 90/751 (2026.01); H10W 72/019 (2026.01); H10W 72/9415 (2026.01); H10W 72/952 (2026.01); H10W 72/953 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 80/743 (2026.01); H10W 90/792 (2026.01);
Abstract

Semiconductor devices and a method for forming a semiconductor device are provided. The semiconductor device includes a substrate, a first semiconductor structure on the substrate, a second semiconductor structure on the first semiconductor structure, and a wire coupled between the substrate and the first semiconductor structure. The first semiconductor structure and the second semiconductor structure are electrically connected to the substrate through the wire. A footprint of the first semiconductor structure is greater than a footprint of the second semiconductor structure.


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