The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Sep. 06, 2023
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Taichi Okano, Yokohama Kanagawa, JP;

Nobuhiro Yamamoto, Yokohama Kanagawa, JP;

Hayato Yamaguchi, Yokohama Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/189 (2026.01); G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/14 (2013.01); H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H05K 1/189 (2013.01); G11B 5/4806 (2013.01); G11B 5/4846 (2013.01);
Abstract

According to one embodiment, a disk device includes a first FPC and second FPCs. The first FPC includes a first insulating layer, a second insulating layer covering the first insulating layer, and a first conductive layer between the first insulating layer and the second insulating layer. The first conductive layer is provided with first terminals. The second insulating layer is provided with holes through which the first terminals are exposed. The second FPC includes a first face facing the second insulating layer, a second face opposite the first face, and second terminals on the first face. The second terminals are joined to the first terminals with a conductive bonding material. At least one second face includes a first area being lower in lightness than a part of the first FPC, the part where the first conductive layer is covered by the second insulating layer.


Find Patent Forward Citations

Loading…