The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Nov. 08, 2021
Applicants:

Sony Group Corporation, Tokyo, JP;

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Yasutaka Higa, Tokyo, JP;

Rintaro Koda, Tokyo, JP;

Hideki Watanabe, Tokyo, JP;

Tatsuya Matou, Tokyo, JP;

Hayato Kamizuru, Kumamoto, JP;

Hirohisa Yasukawa, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/042 (2006.01); H01S 5/0233 (2021.01); H01S 5/42 (2006.01);
U.S. Cl.
CPC ...
H01S 5/04256 (2019.08); H01S 5/0233 (2021.01); H01S 5/423 (2013.01);
Abstract

The present technology provides a surface emitting laser device capable of reducing resistance. The present technology provides a surface emitting laser device including: a first wiring group including a plurality of first wiring lines insulated from each other; a second wiring group including a plurality of second wiring lines insulated from each other; a first board provided with a plurality of light emitting units electrically connected to any one of the plurality of first wiring lines and electrically connected to any one of the plurality of second wiring lines; and a second board disposed to face the first board and provided with the first wiring group and/or the second wiring group.


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