The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Mar. 23, 2023
Applicant:

Ningde Amperex Technology Limited, Ningde, CN;

Inventor:

Yuanjie Zhang, Ningde, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/04 (2006.01); H01M 50/105 (2021.01); H01M 50/534 (2021.01); H01M 50/538 (2021.01);
U.S. Cl.
CPC ...
H01M 10/0431 (2013.01); H01M 50/105 (2021.01); H01M 50/534 (2021.01); H01M 50/538 (2021.01);
Abstract

An electrochemical device includes a packaging bag, an electrode assembly, and a binder. The electrode assembly is disposed in the packaging bag. The binder is configured to bond the electrode assembly to the packaging bag. The binder includes a first bonding layer, a substrate layer, and a second bonding layer that are stacked in sequence. The first bonding layer adheres to a surface of the electrode assembly. The second bonding layer adheres to a surface that is of the packaging bag and that is close to the electrode assembly. A peel strength between the first bonding layer and the electrode assembly is F, a peel strength between the second bonding layer and the packaging bag is F, and the peel strengths satisfy 50 N/m≤F≤1000 N/m and 1≤F/F≤10. A tensile strength of the substrate layer is 100 MPa to 2000 MPa.


Find Patent Forward Citations

Loading…