The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Mar. 27, 2023
Hitachi High-tech Corporation, Tokyo, JP;
Yuki Tanaka, Tokyo, JP;
Takamasa Ichino, Tokyo, JP;
Shintaro Nakatani, Tokyo, JP;
Tomoaki Hyodo, Tokyo, JP;
HITACHI HIGH-TECH CORPORATION, Tokyo, JP;
Abstract
A plasma processing apparatus including a processing chamber and a cylindrical sample stage disposed within the processing chamber and having an upper surface on which the wafer is placed, the sample stage including a disc-like substrate; a dielectric film covering an upper surface of the substrate; and a heater layer disposed inside the dielectric film. The heater layer includes a plurality of film heaters disposed in a plurality of rectangular regions each disposed with one side of the rectangular shapes facing to adjacent regions. A cylindrical power supply connector detachable from a bottom of the substrate is configured to be electrically connected to each of the plurality of film heaters, and a wiring component includes a plurality of lines and is made of a resin-made plate-like component connected to a bottom of the power supply connector, and has an arm part extending along a bottom surface of the substrate.