The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Nov. 19, 2024
Bank of America Corporation, Charlotte, NC (US);
John-David Stuart Marsters, London, GB;
Bank of America Corporation, Charlotte, NC (US);
Abstract
The invention presents a reversible logic gate-based thermal management system with a software-controlled entropy offloading unit (TOU) for high-performance processors. Reversible logic gates are used in high-computation regions to minimize entropy conversion and reduce heat, while non-reversible gates are used in low-computation areas. The system includes a software-controlled entropy offloading module that dynamically transfers excess information entropy from the processor to the TOU. The TOU performs irreversible computations and manages heat through a cascading non-reversible gate structure and modular cooling systems. Real-time thermal sensors and software algorithms monitor processor performance, adjusting offloading rates and cooling mechanisms based on computational loads and thermal data. The system integrates predictive models to forecast future heat generation and proactively adjust entropy management strategies. This architecture ensures efficient thermal regulation and maintains processor performance, with the flexibility to scale for increased computational demands.