The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Dec. 06, 2023
Qualcomm Incorporated, San Diego, CA (US);
Prashanth Kumar Kakkireni, Bengaluru, IN;
Tejas Grandhi, Bangalore, IN;
Ramacharan Sundararaman, San Jose, CA (US);
Christophe Avoinne, San Diego, CA (US);
Qualcomm Incorporated, San Diego, CA (US);
Abstract
Communication of thermal states is described for chiplets. An example includes a chiplet and a plurality of chiplet thermal sensors thermally coupled to the chiplet and configured to generate thermal signals in response to a temperature of the chiplet. A chiplet thermal combiner is coupled to the thermal sensors and configured to receive the thermal signals from the thermal sensors, to generate a combined thermal signal in response, and to generate a temperature signal in response to the combined thermal signal. An external connector is coupled to the chiplet thermal combiner and configured to assert the temperature signal to an external component to activate a thermal mitigation.