The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jun. 02, 2023
Dow Toray Co., Ltd., Tokyo, JP;
Maki Itoh, Ichihara, JP;
Hidefumi Tanaka, Ichihara, JP;
Akihiro Nakamura, Ichihara, JP;
Masahiro Saito, Ichihara, JP;
Michitaka Suto, Ichihara, JP;
DOW TORAY CO., LTD., Tokyo, JP;
Abstract
A curing-reactive organopolysiloxane composition is provided. The composition generally forms a pressure-sensitive adhesive layer which is curable by a hydrosilylation reaction, has excellent adhesiveness and handleability, and is capable of maintaining high transparency over an extended period of time without developing problems such as discoloration or coloration, even when subjected to long-term aging at a high temperature and even when exposed to high-energy rays such as UV rays over an extended period of time. The curing-reactive organopolysiloxane composition can be cured via hydrosilylation reaction. A content of platinum-based metal among a solid content is in the range of from 0.1 to 50 ppm. An adhesive force of a cured layer with a thickness of 50 μm obtained by curing the composition is not less than 0.02N/25 mm. A pressure-sensitive adhesive layer obtained by curing the composition, and an electronic part or a display device using the same, are also provided.