The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

May. 07, 2024
Applicant:

The University of Chicago, Chicago, IL (US);

Inventors:

Supratik Guha, Chicago, IL (US);

Pavani Vamsi Krishna Nittala, Westmont, IL (US);

Xella A Doi, Chicago, IL (US);

Assignee:

THE UNIVERSITY OF CHICAGO, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/159 (2017.01); B29C 64/209 (2017.01); B29C 64/232 (2017.01); B29C 64/245 (2017.01); B29C 64/255 (2017.01); B29C 64/295 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); C23C 16/01 (2006.01);
U.S. Cl.
CPC ...
B29C 64/159 (2017.08); B29C 64/209 (2017.08); B29C 64/232 (2017.08); B29C 64/245 (2017.08); B29C 64/255 (2017.08); B29C 64/295 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); C23C 16/01 (2013.01);
Abstract

A printhead for direct write vapor deposition comprises a nozzle body including a reservoir for holding a material to be printed and a nozzle head protruding from the nozzle body. The nozzle head includes a nozzle opening for ejection of the material as a vapor-phase ink. The nozzle opening is in fluid communication with the reservoir. The nozzle head may protrude from the nozzle body a distance of at least 10 microns. A system for direct write vapor deposition includes the printhead, a heat source positioned to heat the printhead, a substrate in opposition to the nozzle opening for deposition of the vapor-phase ink, and an x-y-z motion stage configured to move the substrate relative to the printhead.


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