The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Nov. 30, 2021
Swiss Wood Solutions Ag, Altdorf, CH;
Munish Chanana, Neuenburg, DE;
Gaspard Antoine Clerc, Dübendorf, CH;
Philipp Friedrich Siegfried Hass, Zürich, CH;
Oliver Frederik Kläusler, Basel, CH;
Walter Ulrich Sonderegger, Männedorf, CH;
Pascal Wyss, Schwerzenbach, CH;
Swiss Wood Solutions AG, Altdorf, CH;
Abstract
A method for densifying a hygroscopic material is disclosed. The method is for hygroscopic material which may be a natural hygroscopic material or wood—The method comprises the steps of providing the hygroscopic material to be densified; pre-conditioning of the hygroscopic material by adjusting the moisture content of the hygroscopic material to a value within a predefined moisture range, if required; simultaneously heating and pressing the gas-tight packed hygroscopic material under predefined temperature and pressure conditions, whereby the moisture content of the hygroscopic material is kept constant; and obtaining a densified material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile