The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Mar. 29, 2021
Corning Incorporated, Corning, NY (US);
George Edward Berkey, Pine City, NY (US);
Richard Alan Quinn, Horseheads, NY (US);
CORNING INCORPORATED, Corning, NY (US);
Abstract
A method for forming a metal flow module includes stacking together a first metal plate having opposing first and second major surfaces and one or more flow channels defined at least in part in the first major surface with a second metal plate having opposing first and second major surfaces, the plates stacked together with their respective first major surfaces facing each other and with a layer of flux positioned in between contacting portions of the respective first major surfaces defined as those portions of the respective first and second major surfaces which would be in contact absent the flux; then heating the plates together in a non-oxidizing atmosphere to thermally bond the contacting portions of the respective first major surfaces of the first and second metal plates. Resulting modules are also disclosed.