The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Jun. 30, 2022
Applicants:

Fuzhou Boe Optoelectronics Technology Co., Ltd., Fujian, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Hui Yu, Beijing, CN;

Han Zhang, Beijing, CN;

Qifei Chen, Beijing, CN;

Dingjie Zheng, Beijing, CN;

Ming Chen, Beijing, CN;

Laiyou Cui, Beijing, CN;

Chengkun Liu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01);
Abstract

A light-emitting module includes a carrier substrate, a first light-emitting circuit layer, a backboard, a mounting cavity and at least one connection member. The first light-emitting circuit layer is disposed on the carrier substrate. The backboard is disposed on a side of the carrier substrate away from the first light-emitting circuit layer and is in contact with the carrier substrate. The mounting cavity is disposed in at least one of the backboard and the carrier substrate, and an inner wall of the mounting cavity is enclosed by both the backboard and the carrier substrate. A connection member is disposed in the mounting cavity and fixedly connected to the carrier substrate and the backboard.


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