The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Dec. 19, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Jeffrey Sailer, Cedar Rapids, IA (US);

Howard E. Chen, Anaheim, CA (US);

Yi Liu, San Diego, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 74/114 (2026.01); H10W 74/131 (2026.01); H10W 90/00 (2026.01); H10W 90/701 (2026.01);
Abstract

An electrical package can include a substrate having a first side and a second side opposite the first side. One or more electrical components mounted to the substrate, and a plurality of electrically conductive interconnect members can be coupled to the second side of the substrate. At least one of the interconnect members can have an elongated shape with a length that is longer than a width. The interconnect member with the elongated shape positioned can be at or proximate one of the corners. The interconnect members can be arranged as a grid, with first interconnect members each occupying a single grid cell, and second interconnect members each occupying at least two grid cells. The second interconnect members can have a shape of two of the first interconnect members coupled by a bridge portion.


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