The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
May. 15, 2023
Mitsubishi Electric Corporation, Tokyo, JP;
Tomoaki Noguchi, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate having a first surface, a second surface facing the first surface, and an outline, and an impurity region located on a side of the first surface in the semiconductor substrate. The second surface has a plurality of concave portions, and each of the plurality of concave portions open toward a side opposite to the first surface and extend along a direction perpendicular to a direction in which the semiconductor substrate is susceptible to warping most.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile