The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Apr. 27, 2023
Applicant:

Nuvoton Technology Corporation, Hsinchu Science Park, TW;

Inventors:

Chih-Hsuan Chien, Hsinchu Science Park, TW;

Kai-Yu Peng, Hsinchu Science Park, TW;

Yu-Hsuan Ho, Hsinchu Science Park, TW;

Assignee:

Nuvoton Technology Corporation, Hsinchu Science Park, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/47 (2026.01); H10W 20/00 (2026.01); H10W 20/43 (2026.01);
U.S. Cl.
CPC ...
H10W 20/47 (2026.01); H10W 20/075 (2026.01); H10W 20/076 (2026.01); H10W 20/077 (2026.01); H10W 20/43 (2026.01);
Abstract

A sensing device and a manufacturing method thereof are provided. The sensing device includes a substrate, a first electrode layer, a first sensing layer, a first dielectric layer, a second electrode layer, a second sensing layer, a second dielectric layer, and a capping layer. The first electrode layer is disposed on the substrate. The first sensing layer is disposed on the first electrode layer and has a plurality of holes. The first dielectric layer is disposed on the first sensing layer. The second electrode layer is disposed on the first dielectric layer. The second sensing layer is disposed on the second electrode layer. A material of the second sensing layer is different from a material of the first sensing layer. The second dielectric layer is disposed on the second sensing layer. The capping layer is disposed on the substrate.


Find Patent Forward Citations

Loading…