The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Aug. 22, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jeongyeon Seo, Suwon-si, KR;

Sungwoo Kang, Suwon-si, KR;

Hyonwook Ra, Suwon-si, KR;

Hongsik Shin, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 84/83 (2025.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/427 (2026.01); H10D 30/6735 (2025.01); H10D 62/121 (2025.01); H10D 84/83 (2025.01); H10W 20/42 (2026.01);
Abstract

An integrated circuit device includes a fin-type active region that extends from a substrate and in a first lateral direction, a device isolation film on a trench region on the substrate, an insulating liner structure that extends through the substrate in a vertical direction and contacts the device isolation film at a first vertical level, a via power rail that extends through the device isolation film in the vertical direction and including a first bottom surface at a second vertical level, and a backside power rail including a main rail and a protrusion rail, where the main rail extends through the substrate and the insulating liner structure in the vertical direction, and where the protrusion rail extends from the main rail toward the via power rail.


Find Patent Forward Citations

Loading…