The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
May. 16, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Minsung Kim, Suwon-si, KR;
Youngsoo Lee, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); H01L 21/6838 (2013.01);
Abstract
A chip pick-up head includes a collet in contact with an upper surface of a chip of a diced wafer. The chip pick-up head detaches and picks up the chip from an adhesive film. The chip pick-up head further includes a head part coupled to the collet, a vibration transfer rod coupled to the head part and configured to transfer a vibration to the head part and the collet, and a vibration generator coupled to the vibration transfer rod and configured to generate the vibration.