Wafer cleaning water supply system and wafer cleaning water supply method

Abstract

The wafer cleaning water supply system of the present invention has a wafer cleaning water production unit producing wafer cleaning water having a chemical agent, a replenishment pipe extending from the wafer cleaning water production unit, and a circulation-type cleaning water supply pipe connected to the replenishment pipe. The circulation-type cleaning water supply pipe feeds a liquid to a use point via a feeding pump and is provided with a supply-side flowmeter and a recovery-side flowmeter. The measurement results of the supply-side and recovery-side flowmeters and the water quality data obtained by a monitor of a sampling pipe for monitoring are transmitted to a control device, which controls the wafer cleaning water production unit. With such a configuration, the wafer cleaning water supply system involves a small amount of excess water, dissolved gas is less likely to be mixed with the wafer cleaning water, and space-saving is possible.