The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Feb. 15, 2023
Applicant:
Fujifilm Electronic Materials U.s.a., Inc., N. Kingstown, RI (US);
Inventor:
Mick Bjelopavlic, Chandler, AZ (US);
Assignee:
Fujifilm Electronic Materials U.S.A., Inc., North Kingstown, RI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/66 (2026.01); C09K 13/06 (2006.01); H10D 84/83 (2025.01); H10D 30/01 (2025.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10P 14/694 (2026.01);
U.S. Cl.
CPC ...
H10P 50/667 (2026.01); C09K 13/06 (2013.01); H10D 84/83 (2025.01); H10D 30/014 (2025.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 30/6739 (2025.01); H10D 30/6748 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10P 14/69433 (2026.01);
Abstract
The present disclosure is directed to etching compositions that are useful for, e.g., selectively removing silicon from a semiconductor substrate as an intermediate step in a multistep semiconductor manufacturing process.