The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Nov. 21, 2022
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Akiko Seki, Tokyo, JP;
Takashi Watanabe, Tokyo, JP;
Yukari Wada, Tokyo, JP;
Susumu Taniguchi, Tokyo, JP;
Hiroyuki Uematsu, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/85 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8506 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
Abstract
A circuit substrate is a circuit substrate having at least one pair of terminals, wherein a bonding material containing a metal element is disposed above the terminals, the pair of terminals and the bonding material are disposed inside a wall formed by an insulator, and the wall has an uneven portion on an inner side surface.