The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Apr. 04, 2020
Applicant:
Ams Ag, Premstaetten, AT;
Inventors:
Assignee:
ams AG, Premstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 72/90 (2026.01); H10F 39/10 (2025.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10F 39/103 (2025.01); H10W 72/019 (2026.01); H10W 72/90 (2026.01); H10W 72/923 (2026.01); H10W 72/942 (2026.01); H10W 72/952 (2026.01); H10W 72/953 (2026.01);
Abstract
An apparatus includes an optical device () and an electrically conductive bond pad (). A multi-layer stack () of electrically conductive materials is disposed on the bond pad (). An ITO layer () is disposed at least partially on the optical device () and makes ohmic contact with the multi-layer stack ().
Eilmsteiner, Gerhard. (2026). On-chip integration of indium tin oxide (ito) layers for ohmic contact to bond pads (U.S. Patent No. 12727261). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12727261
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile