The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Mar. 04, 2024
Applicant:

Denso Corporation, Kariya-city, JP;

Inventors:

Tetsuya Matsuoka, Kariya-city, JP;

Yuta Hashimoto, Kariya-city, JP;

Tomoki Kozawa, Kariya-city, JP;

Kazuya Takeuchi, Kariya-city, JP;

Shinji Takai, Kariya-city, JP;

Takahiro Shimizu, Kariya-city, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01);
Abstract

The power conversion device has a case, a semiconductor module, a first cooler that cools the semiconductor module from one side, a second cooler that cools the semiconductor module from the back side, and a coupling pipe that couples a flow path of the first cooler with a flow path of the second cooler. A flow rate of the refrigerant is made different between the flow paths, and the flow path having a larger flow rate is larger in cross-sectional area than the flow path having a smaller flow rate. The first cooler having a wider flow path is formed by a part of the case that houses the semiconductor module, and the second cooler having a narrower flow path is housed in the case together with the semiconductor module.


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