The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Jul. 19, 2023
Applicant:

Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, HK;

Inventors:

Danting Xu, Hong Kong, HK;

Kun Wu, Shenzhen, CN;

Ziyang Gao, Hong Kong, HK;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01R 12/52 (2011.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01R 12/52 (2013.01); H05K 1/0206 (2013.01); H05K 1/18 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A power-converter module has a switching Printed Circuit Board (PCB) with power transistors generating heat. Ground, an input power supply, and an output power supply to the power transistors connect through metal traces on the switching PCB directly to interposer heat sinks that are soldered to the switching PCB. Copper bars attached to the bottoms of interposer heat sinks fit in holes in a system PCB to make connections. The metal traces and interposer heat sinks carry supply or ground currents and heat away from the power transistors. These power and ground currents continue from the interposer heat sinks through the copper bars to the system PCB. An interposer PCB has soler pads and solder balls to carry control signals from the system PCB to the switching PCB, bypassing the interposer heat sinks. Copper bars can be sintered, soldered, or welded to or integral with the interposer heat sinks.


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