The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Feb. 21, 2024
Applicant:

Chicony Electronics Co., Ltd., New Taipei City, TW;

Inventors:

Chih-Hung Lin, New Taipei City, TW;

Chih-Yi Lu, New Taipei City, TW;

Assignee:

CHICONY ELECTRONICS CO., LTD., New Taipei City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 3/4617 (2013.01); H05K 2201/09036 (2013.01); H05K 2203/0278 (2013.01);
Abstract

A membrane circuit board includes a first substrate, a second substrate, a space layer and a conductive adhesive. The first substrate includes a plurality of first butting circuits and at least one first transmission circuit. The first transmission circuit is connected to one of the first butting circuits. The second substrate includes a plurality of second butting circuits, each corresponding to one of the first butting circuits. The space layer is disposed between the first substrate and the second substrate. The space layer includes a butting opening and at least one first stress weakening portion. One end of the first stress weakening portion is connected to the butting opening, and the first stress weakening portion corresponds to the first transmission circuit. The conductive adhesive is disposed within the butting opening and is in contact with both the first butting circuits and the second butting circuits.


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Lin, Chih-Hung. (2026). Membrane circuit board (U.S. Patent No. 12727079). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12727079

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