The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Mar. 31, 2022
Hefei Boe Ruisheng Technology Co., Ltd., Hefei, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei BOE Ruisheng Technology Co., Ltd., Hefei, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
The present disclosure provides a circuit board, an electronic apparatus and a manufacturing method for a circuit board. The circuit board includes: a substrate; a plurality of pad zones on the substrate; and a first reflective layer, where the first reflective layer is located at the same side of the substrate as the plurality of pad zones, the first reflective layer includes a plurality of mutually spaced reflective patterns, a gap is provided between the adjacent reflective patterns, and the first reflective layer has a first hollow in a zone where each pad zone of the plurality of pad zones is located.