The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Sep. 14, 2023
Applicant:

Innolux Corporation, Miaoli County, TW;

Inventors:

Mu-Fan Chang, Miaoli County, TW;

Yi-Hua Hsu, Miaoli County, TW;

Hung-Sheng Liao, Miaoli County, TW;

Min-Hsin Lo, Miaoli County, TW;

Ming-Chun Tseng, Miaoli County, TW;

Ker-Yih Kao, Miaoli County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H10W 42/60 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0259 (2013.01); H10W 42/60 (2026.01); H05K 2201/10128 (2013.01); H10W 72/932 (2026.01);
Abstract

An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.


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