The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Aug. 04, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Rubayet Shafin, Allen, TX (US);

Boon Loong Ng, Plano, TX (US);

Peshal Nayak, Plano, TX (US);

Vishnu Vardhan Ratnam, Plano, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 74/0816 (2024.01); H04W 76/15 (2018.01); H04W 76/50 (2018.01); H04W 84/12 (2009.01);
U.S. Cl.
CPC ...
H04W 74/0816 (2013.01); H04W 76/15 (2018.02); H04W 76/50 (2018.02); H04W 84/12 (2013.01);
Abstract

A wireless communication network includes an access point (AP) multi-link device (MLD) and a non-AP MLD. The AP MLD generates an Extreme High Throughput (EHT) variant Enhanced Distributed Channel Access (EDCA) Parameters Set element including an EDCA Parameters Set element and a Link Indication. The EDCA Parameters Set element applies to a non-primary link between the AP MLD and the non-AP MLD. The AP MLD generates a beacon frame including the EHT variant EDCA Parameters Set element and the Link Indication subfield and transmits the beacon frame to the non-AP MLD.


Find Patent Forward Citations

Loading…