logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12726773 B1

PDFFull Text
Date of Patent:
Sep. 01, 2026

Filed:

Mar. 22, 2023

Mems sensor with a thin region

Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventor:

Siarhei Dmitrievich Barsukou, Takarazuka, JP;

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:

Lando & Anastasi, LLP

Primary Examiner:

Jarrett J Stark

Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 1/02 (2006.01); H04R 7/06 (2006.01); H04R 17/02 (2006.01); H04R 31/00 (2006.01); H10N 30/30 (2023.01); H10N 30/87 (2023.01); H04M 1/02 (2006.01); H10N 30/05 (2023.01); H10N 30/50 (2023.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); B81B 3/0021 (2013.01); B81B 3/0027 (2013.01); B81C 1/0015 (2013.01); H04R 1/028 (2013.01); H04R 7/06 (2013.01); H04R 31/006 (2013.01); H10N 30/30 (2023.02); H10N 30/872 (2023.02); B81B 2201/0257 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0178 (2013.01); H04M 1/026 (2013.01); H04R 2201/003 (2013.01); H04R 2499/11 (2013.01); H10N 30/05 (2023.02); H10N 30/503 (2023.02);
Abstract

A piezoelectric microelectromechanical systems microphone is provided comprising a sensor, an anchor region at which the sensor is supported by a substrate, a first region of the sensor adjacent to the anchor region, the first region having at least one piezoelectric layer and at least one electrode, and a second region of the sensor, the second region being adjacent to the first region, having at least one piezoelectric layer and at least one electrode, and having a thickness less than the thickness of the first region. A method for manufacturing a piezoelectric microelectromechanical systems microphone is also provided.

Find Patent Forward Citations

Barsukou, Siarhei. (2026). Mems sensor with a thin region (U.S. Patent No. 12726773). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12726773

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…