The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Oct. 06, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Rei Goto, Osaka, JP;

Hironori Fukuhara, Ibaraki, JP;

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/02 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/56 (2006.01); H10N 30/067 (2023.01); H10N 30/50 (2023.01); H10N 30/853 (2023.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H03H 3/02 (2013.01); H03H 9/02574 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/568 (2013.01); H10N 30/067 (2023.02); H10N 30/50 (2023.02); H10N 30/853 (2023.02); H03H 2003/028 (2013.01); H03H 9/0211 (2013.01); H03H 9/02559 (2013.01); H03H 9/02677 (2013.01); H04B 1/40 (2013.01); Y10T 29/42 (2015.01);
Abstract

A method of making an acoustic wave device includes forming or providing a substrate, forming or providing a functional layer over at least a portion of the substrate, forming or providing a piezoelectric layer over at least a portion of the functional layer, and forming or providing an interdigital transducer electrode over the piezoelectric layer. Forming or providing the piezoelectric layer includes removing a portion of the piezoelectric layer so that the piezoelectric layer has an outer edge spaced inward of an outer edge of the substrate, and so that the outer edge of the piezoelectric layer is tapered at an angle relative to a surface of the substrate to thereby reduce an acoustic reflection magnitude at said outer edge of the piezoelectric layer.


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