The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Sep. 22, 2023
Applicant:

Proterial, Ltd., Tokyo, JP;

Inventors:

Jun Umetsu, Tokyo, JP;

Noriyuki Takahashi, Tokyo, JP;

Assignee:

Proterial, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H02K 15/12 (2006.01); H02K 15/33 (2025.01);
U.S. Cl.
CPC ...
H02K 15/33 (2025.01); H02K 15/12 (2013.01);
Abstract

A wiring component is provided with a plurality of electric wires, and a holding portion that batch holds respective portions of the plurality of electric wires. The holding portion includes a holder that supports the plurality of electric wires in a predetermined positional relationship, and a resin mold portion composed of resin molded to cover the holder and the respective portions of the plurality of electric wires. The holder includes a substrate portion and a plurality of wire-holding portions formed protruding from the substrate portion. The plurality of electric wires are supported by the plurality of wire-holding portions, respectively. A notch or a through-hole is formed in the substrate portion corresponding to a portion into which molten resin is injected when forming the resin mold portion.


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