The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Nov. 17, 2022
Applicant:

Hyosung Heavy Industries Corporation, Seoul, KR;

Inventors:

Yong Hee Park, Anyang-si, KR;

Nam Joon Ku, Anyang-si, KR;

Ki Ryang Kwon, Seoul, KR;

Jung Won Hong, Bucheon-si, KR;

Hong Ju Jung, Seoul, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02B 1/56 (2006.01); H05K 7/02 (2006.01); H02B 1/46 (2006.01);
U.S. Cl.
CPC ...
H02B 1/56 (2013.01); H05K 7/023 (2013.01); H02B 1/46 (2013.01);
Abstract

The present disclosure relates to a submodule. An enclosuremay form the exterior of the submoduleof the present disclosure. A first openingmay be formed on one side surfaceof the enclosure. A heat sinkmay be installed in the first opening. The inner surface of the heat sinkfaces the inside of the enclosure, and the outer surface of the heat sinkmay form one outer surface of the enclosure. A heating element such as a power semiconductoror a control board may be installed on the heat sink. An inletand an outletmay be provided at one side edge of the heat sinkto communicate with a flow path formed therein and allow cooling fluid to flow in and out.


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