The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Jun. 15, 2023
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Kadoma, JP;

Inventors:

Takuto Abe, Osaka, JP;

Keishu Muraoka, Osaka, JP;

Kota Araki, Osaka, JP;

Takeshi Haritani, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0443 (2019.05); G06F 2203/04107 (2013.01);
Abstract

An adherend-equipped substrate includes a substrate and an adherend. The adherend is bonded to a front face of the substrate with the adhesive. The substrate includes a substrate body and a protective layer. The protective layer having a front face is disposed at a side of a front face of the substrate body. The front face of the protective layer has a first region and a second region. The first region is a region to which the adherend is bonded with the adhesive. The first region has a first contact angle. The second region is a region other than the first region and has a second contact angle. The first contact angle is smaller than the second contact angle.


Find Patent Forward Citations

Abe, Takuto. (2026). Substrate-bound adherend (U.S. Patent No. 12724517). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12724517

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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