The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Mar. 12, 2021
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Hisashi Ogasawara, Otsu, JP;

Hitoshi Araki, Otsu, JP;

Masaya Jukei, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/028 (2006.01); C08G 73/10 (2006.01); G03F 7/037 (2006.01); G03F 7/038 (2006.01); H01Q 9/04 (2006.01); H10W 70/69 (2026.01); H10W 74/47 (2026.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 70/652 (2026.01); H10W 70/66 (2026.01); H10W 70/685 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/29 (2026.01); H10W 72/90 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
G03F 7/028 (2013.01); C08G 73/1053 (2013.01); G03F 7/037 (2013.01); G03F 7/038 (2013.01); H01Q 9/0407 (2013.01); H10W 70/69 (2026.01); H10W 74/47 (2026.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 70/652 (2026.01); H10W 70/66 (2026.01); H10W 70/685 (2026.01); H10W 72/01935 (2026.01); H10W 72/242 (2026.01); H10W 72/29 (2026.01); H10W 72/90 (2026.01); H10W 72/9223 (2026.01); H10W 72/923 (2026.01); H10W 72/942 (2026.01); H10W 72/952 (2026.01); H10W 74/147 (2026.01);
Abstract

The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).


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