The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Mar. 30, 2022
Applicant:

Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;

Inventors:

Kosuke Okahashi, Tokyo, JP;

Shingo Takano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); G02B 6/12 (2006.01); G02F 1/035 (2006.01);
U.S. Cl.
CPC ...
G02F 1/035 (2013.01); G02B 6/12 (2013.01); G02F 1/01 (2013.01); G02F 2201/07 (2013.01); G02F 2202/20 (2013.01);
Abstract

An object of the present invention is to provide an optical waveguide device that prevents peeling of an optical waveguide substrate and that suppresses a propagation loss of a light wave of an optical waveguide. An optical waveguide device of the present invention includes an optical waveguide substrateon which an optical waveguideis formed, a reinforcing substratedisposed under the optical waveguide substrate, a lower buffer layer Bdisposed between the optical waveguide substrate and the reinforcing substrate to join both of the optical waveguide substrate and the reinforcing substrate, and an upper buffer layer Bdisposed on an upper side of the optical waveguide substrate in contact with the optical waveguide substrate, in which a thickness dof the upper buffer layer is formed to be smaller than a thickness dof the lower buffer layer (d<d).


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