The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Mar. 29, 2024
Applicant:

Xingr Technologies (Zhejiang) Limited, Yiwu City, CN;

Inventors:

Choon Leong Lou, Singapore, SG;

Ho Yeh Chen, Zhubei City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/10 (2006.01); G01R 1/04 (2006.01); G01R 1/073 (2006.01); G01R 1/16 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2875 (2013.01); G01R 1/0416 (2013.01); G01R 1/07342 (2013.01); G01R 1/16 (2013.01); G01R 31/2831 (2013.01); G01R 31/2862 (2013.01); G01R 31/2863 (2013.01); G01R 31/2868 (2013.01); G01R 31/2891 (2013.01);
Abstract

A wafer test cassette, a wafer test system, and a wafer test method are provided. The wafer test cassette includes a first housing including a first magnetic member, a second housing including a second magnetic member corresponding to the first magnetic member, a first fluid port, and a gas supply device. The first housing and the second housing are tightly coupled to each other by which a test space is defined. The first housing includes a probe card, and the second housing carries a wafer. When the first housing and the second housing are coupled, a probe is electrically in contact with a pad of the wafer. The first fluid port is disposed in the first housing or the second housing, and receives an external gas to the test space. After the test space receives the external gas, an air pressure value thereof is greater than an atmospheric pressure.


Find Patent Forward Citations

Lou, Choon. (2026). Wafer test cassette, wafer test system and wafer test method (U.S. Patent No. 12724064). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12724064

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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