The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Dec. 14, 2023
Electronics and Telecommunications Research Institute, Daejeon, KR;
Yong Kwi Lee, Daejeon, KR;
Hyun Chul Kang, Daejeon, KR;
Ji Yeon Son, Daejeon, KR;
Young Seog Yoon, Daejeon, KR;
Chang-Beom Kim, Daejeon, KR;
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;
Abstract
The present invention relates to a molding thickness inspection device, a molding thickness inspection system including the same, and a molding thickness inspection method. The molding thickness inspection system according to an aspect of the present invention includes a molding thickness inspection device in which a plurality of illuminance sensors are installed and which accommodates an inspection target product which is illuminated, and a control device configured to inspect whether a thickness of the inspection target product is abnormal based on illuminance data measured by the plurality of illuminance sensors.