The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Jan. 27, 2021
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Shouji Kaji, Shiraoka, JP;

Takaaki Sakon, Minamisaitama-gun, JP;

Taku Sasaki, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01); C08K 3/041 (2017.05); C08K 3/08 (2013.01); C09J 7/38 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 133/08 (2013.01); C08K 2003/0893 (2013.01); C08K 2201/001 (2013.01); C09J 2301/302 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2433/00 (2013.01);
Abstract

The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer comprising a photo-cured acrylic resin, a metal having a lower potential than that of iron, and an electroconductive material, wherein the pressure-sensitive adhesive layer has a total light transmittance X, per micrometer of the thickness, of 99.85% or less, and the pressure-sensitive adhesive layer has a total light transmittance Y of 6% or more. The present invention can provide a pressure-sensitive adhesive tape having a great adhesive force on both the front side and the back side and having good sacrificial corrosion resistance.


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