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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12723169 B1

PDFFull Text
Date of Patent:
Sep. 01, 2026

Filed:

Jul. 13, 2023

Photosensitive resin composition, cured product and manufacturing method thereof, light conversion layer and light emitting device

Applicant:

Advanced Echem Materials Company Limited, Taoyuan, TW;

Inventors:

Chun-Kuan Tai, Taoyuan, TW;

Ya-Qian Chen, Taoyuan, TW;

Yu-Chun Chen, Taoyuan, TW;

Assignee:

Advanced Echem Materials Company Limited, Taoyuan, TW;

Attorney:

JCIPRNET

Primary Examiner:

Chanceity N Robinson

Int. Cl.
CPC ...
C09D 11/50 (2014.01); C09D 11/033 (2014.01); C09D 11/037 (2014.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 11/322 (2014.01); C09D 11/36 (2014.01); C09D 11/38 (2014.01); G02F 1/1335 (2006.01); G02F 1/13357 (2006.01);
U.S. Cl.
CPC ...
C09D 11/50 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); C09D 11/322 (2013.01); C09D 11/36 (2013.01); C09D 11/38 (2013.01); G02F 1/133614 (2021.01); G02F 1/133621 (2013.01);
Abstract

A photosensitive resin composition, a cured product and a manufacturing method thereof, a light conversion layer and a light emitting device are provided. The photosensitive resin composition includes a resin (A), an ethylenically unsaturated monomer (B), a photopolymerization initiator (C), a pigment (D) and a solvent (E). The resin (A) includes an alkali-soluble resin (A-1), other resin (A-2) or the combination thereof. The alkali-soluble resin (A-1) includes a structural unit represented by the following formula (A1). The photopolymerization initiator (C) includes a compound represented by the following formula (C1). In formula (A1) and formula (C1), the definition of each substituent is the same as that in the detailed description.

Find Patent Forward Citations

Tai, Chun-Kuan. (2026). Photosensitive resin composition, cured product and manufacturing method thereof, light conversion layer and light emitting device (U.S. Patent No. 12723169). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12723169

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