The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Oct. 28, 2025
Applicants:

Varad Agarwal, Miami, FL (US);

Ambreen Nisar, Miami, FL (US);

Tony Thomas, Miami, FL (US);

Inventors:

Varad Agarwal, Miami, FL (US);

Ambreen Nisar, Miami, FL (US);

Tony Thomas, Miami, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/56 (2006.01); B28B 1/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C04B 35/626 (2006.01); C04B 35/634 (2006.01); C04B 35/64 (2006.01);
U.S. Cl.
CPC ...
C04B 35/5607 (2013.01); B33Y 70/00 (2014.12); C04B 35/6263 (2013.01); C04B 35/63424 (2013.01); C04B 35/64 (2013.01); B28B 1/001 (2013.01); B33Y 10/00 (2014.12); C04B 2235/3839 (2013.01); C04B 2235/6021 (2013.01);
Abstract

Compositions and methods are provided for generating ultra-high loaded, ultra-high temperature ceramics (UHTCs) ink for extrusion three-dimensional (3D) printing with enhanced shrinkage control. The advanced formulations significantly enhance printability, densification, and microstructural control of complex UHTC components, facilitating near-net-shape fabrication with improved mechanical properties and thermal stability. Consequently, the innovation significantly diminishes the necessity for extensive post-processing, minimizes defects such as shrinkage and cracking, and broadens the applicability of additive manufacturing techniques for high-performance refractory materials in extreme environments.


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