The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2026

Filed:

Apr. 24, 2024
Applicant:

Prinics Co., Ltd., Suwon-Si, KR;

Inventor:

Kwang-Ho Noh, Suwon-Si, KR;

Assignee:

PRINICS CO., LTD., Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01); B41J 2/35 (2006.01); B41J 2/375 (2006.01);
U.S. Cl.
CPC ...
B41J 2/3352 (2013.01); B41J 2/33505 (2013.01); B41J 2/33515 (2013.01); B41J 2/33535 (2013.01); B41J 2/3354 (2013.01); B41J 2/3355 (2013.01); B41J 2/3358 (2013.01); B41J 2/35 (2013.01); B41J 2/375 (2013.01);
Abstract

The thermal print head having COF structure is disclosed. According to the present invention, productivity can be improved with a low step of a protective resin by using a COF method, the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate by electrically connecting the ceramic substrate and the COF through thermal compression using ACF, and the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate.


Find Patent Forward Citations

Quick Actions:

Noh, Kwang-Ho. (2026). Thermal print head with cof structure (U.S. Patent No. 12722401). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12722401

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…